Solder Joint Reliability Modeling by Sequential Artificial...

IEEE Access 2020 Vol. 8

Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

Yuan, Cadmus C. A., Lee, Chang-Chi
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Volume:
8
Year:
2020
Journal:
IEEE Access
DOI:
10.1109/ACCESS.2020.3014156
File:
PDF, 1.43 MB
2020
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