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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel, Phommahaxay, Alain, Kennes, Koen, Bex, Pieter, Fodor, Ferenc, Liebens, Maarten, Slabbekoorn, John, Miller, Andy, Beyer, Gerald, Beyne, EricYear:
2020
DOI:
10.1109/ECTC32862.2020.00208
File:
PDF, 995 KB
2020