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Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
Tsurumi, Naoaki, Tsuji, Yuta, Baba, Taiki, Murata, Hiroyuki, Masago, Noriyuki, Yoshizawa, KazunariJournal:
The Journal of Adhesion
DOI:
10.1080/00218464.2020.1807958
Date:
August, 2020
File:
PDF, 8.27 MB
2020