A Hybrid 3D Interconnect With 2x Bandwidth Density...

  • Main
  • 2020
  • A Hybrid 3D Interconnect With 2x Bandwidth Density...
IEEE Transactions on Circuits and Systems I: Regular Papers 2020

A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC

Gopal, Srinivasan, Das, Sourav, Pande, Partha Pratim, Heo, Deukhyoun
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2020
Journal:
IEEE Transactions on Circuits and Systems I: Regular Papers
DOI:
10.1109/TCSI.2020.3013092
File:
PDF, 3.12 MB
2020
Conversion to is in progress
Conversion to is failed