In Situ Transmission Electron Microscopy Study of...

IEEE Transactions on Device and Materials Reliability 2020 / 9 Vol. 20; Iss. 3

In Situ Transmission Electron Microscopy Study of Conductive Filament Formation in Copper Oxides

Tian, Xinchun, Yazdanparast, Sanaz, Brennecka, Geoff, Tan, Xiaoli
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Volume:
20
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2020.3015398
Date:
September, 2020
File:
PDF, 1.01 MB
2020
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