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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology
Son, SeungNam, Khim, DongHyun, Yun, SeokHun, Park, JunHwan, Jeong, EunTaek, Yi, JiHun, Yoo, JinKun, Yang, KiYeul, Yi, MinJae, Lee, SangHyoun, Do, WonChul, Khim, JinYoungYear:
2020
DOI:
10.1109/ECTC32862.2020.00298
File:
PDF, 1.07 MB
2020