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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Novel Low Temperature Curable Photo-Patternable Low Dk/Df for Wafer Level Packaging (WLP)
Han, Katherine, Akatsuka, Yasumasa, Cordero, Jenna, Inagaki, Shinya, Nawrocki, DanielYear:
2020
DOI:
10.1109/ECTC32862.2020.00026
File:
PDF, 729 KB
2020