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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4 th Industrial Revolution Era
Choi, MiKyeong, Jung, HyunHye, Oh, KwangSeok, Ryu, DongSu, Lee, SangHyoun, Do, WonChul, Kweon, YoungDo, Kelly, Mike, Park, KyungRok, Khim, JinYoung, Huemoeller, RonYear:
2020
DOI:
10.1109/ECTC32862.2020.00211
File:
PDF, 389 KB
2020