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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation challenges of warpage for wafer- and panel level packaging
Dijk, Marius van, Kuttler, Simon, Rost, Florian, Jeaschke, Johannes, Walter, Hans, Wittler, Olaf, Braun, Tanja, Schneider-Ramelow, MartinYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152797
File:
PDF, 338 KB
2020