[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions
Schiffmacher, Alexander, Wilde, Juergen, Kempiak, Carsten, Lindemann, Andreas, Rudzki, Jacek, Osterwald, FrankYear:
2020
DOI:
10.1109/ECTC32862.2020.00094
File:
PDF, 2.30 MB
2020