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[IEEE 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Reno, NV, USA (2020.7.28-2020.8.28)] 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Mechanism Analysis on Radio Frequency Radiation in IC/Package with Bonding Wires
Ouyang, Muqi, Sun, Yin, Lee, Jongjoo, Kim, Jingook, Hwang, ChulsoonYear:
2020
DOI:
10.1109/EMCSI38923.2020.9191486
File:
PDF, 1.45 MB
2020