![](/img/cover-not-exists.png)
[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A Comprehensive Study of Electromigration in Lead-free Solder Joint
Xu, Jiefeng, Cai, Chongyang, Pham, Vanlai, Pan, Ke, Wang, Huayan, Park, SeungbaeYear:
2020
DOI:
10.1109/ECTC32862.2020.00054
File:
PDF, 1.02 MB
2020