[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits
Erp, Remco van, Kampitsis, Georgios, Nela, Luca, Ardebili, Reza Soleimanzadeh, Matioli, ElisonYear:
2020
DOI:
10.1109/ITherm45881.2020.9190356
File:
PDF, 2.93 MB
2020