[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Package on System Level Solder Joint Stress Analysis Under Shock Test
Shih, Hsin-Chih, Liao, HowardTW, Chen, Ryan, Liao, York, Tarng, David, Hung, CPYear:
2020
DOI:
10.1109/ECTC32862.2020.00238
File:
PDF, 1.08 MB
2020