[IEEE 2020 19th IEEE Intersociety Conference on Thermal and...

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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

Hoque, Mohd Aminul, Ashraful Haq, Mohammad, Chowdhury, Md Mahmudur, Suhling, Jeffrey C., Lall, Pradeep
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Year:
2020
DOI:
10.1109/ITherm45881.2020.9190293
File:
PDF, 995 KB
2020
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