[IEEE 2020 19th IEEE Intersociety Conference on Thermal and...

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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Interface Density Effects on Cross-Plane Thermal Conductance of Nanolaminate Thin Films

Wilson, Adam A., Warzoha, Ronald, Sharar, Darin J., Smith, Andrew N.
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Year:
2020
DOI:
10.1109/ITherm45881.2020.9190379
File:
PDF, 594 KB
2020
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