[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Fatigue Performance of Doped SAC Solder Joints in BGA Assembly
Wei, Xin, Su, Sinan, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, Lall, PradeepYear:
2020
DOI:
10.1109/ITherm45881.2020.9190479
File:
PDF, 1.65 MB
2020