[IEEE 2020 19th IEEE Intersociety Conference on Thermal and...

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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermo-Mechanical Design Considerations in 3D-Integrated SiC Power Device Package

McCluskey, F. Patrick, Yun, He, Buxbaum, Clifton Edward, Yuruker, Sevket, Mandel, Raphael, Ohadi, Michael, Park, Yongwan, Chakraborty, Shiladri, Khaligh, Alireza, Boteler, Lauren, Hinojosa, Miguel
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Year:
2020
DOI:
10.1109/ITherm45881.2020.9190490
File:
PDF, 930 KB
2020
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