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The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits
Wang, Ziren, Gao, Jinchun, Flowers, George T., Yi, Wei, Wu, Yongle, Cheng, ZhongyangYear:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.3019803
File:
PDF, 1.54 MB
2020