![](/img/cover-not-exists.png)
[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A Study on the Mechanical Debonding Process through Static-Elastic Stress Analysis for 3-D Wafer Level Packages (WLPs)
Lee, Hyeong-Gi, Kim, Dae-Sung, Cho, Jung-Hyun, Lee, Jung-Hyuk, Park, Jae-Yong, Kim, Min-Ho, Lee, Jae-WookYear:
2020
DOI:
10.1109/ECTC32862.2020.00364
File:
PDF, 720 KB
2020