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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Mechanical Design of a 3D CMOS Compatible Microelectrode Array for Neural Interfacing
Weekers, Bart, Haouari, Rachid, Braeken, Dries, Rochus, VeroniqueYear:
2020
DOI:
10.1109/EuroSimE48426.2020.9152632
File:
PDF, 456 KB
2020