[IEEE 2020 21st International Conference on Thermal,...

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[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Structure Function Assisted Thermal Coupling Analysis for Paralleling Power Semiconductor Chips

Pottage, Daniel, Li, Xiang, Packwood, Matt, Li, Daohui, Wang, Yangang
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Year:
2020
DOI:
10.1109/EuroSimE48426.2020.9152725
File:
PDF, 303 KB
2020
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