[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Compatibility Analysis of Liquid Gallium and Common Packaging Metals for Application in Electronic Component Thermal Management
McAfee, Rachel, Fish, Michael, Baker, David, Gess, Joshua, Boteler, LaurenYear:
2020
DOI:
10.1109/itherm45881.2020.9190557
File:
PDF, 1.02 MB
2020