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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Systematic Approach in Intel SoC (System on Chip) Thermal Solution Design using CFD (Computational Fluid Dynamics) Simulation
Sim, Chun Howe CH, Ching Lim, Chew, Hoskoti, VijayYear:
2020
DOI:
10.1109/itherm45881.2020.9190601
File:
PDF, 420 KB
2020