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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and Narrow Pitch for Antenna in Package
Li, Xinrong, Ogawa, Tsuyoshi, Shibata, Tomoaki, Yoneda, Satoshi, Suzuki, Naoya, Nonaka, ToshihisaYear:
2020
DOI:
10.1109/ECTC32862.2020.00032
File:
PDF, 930 KB
2020