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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of Combining Solder Pastes with SAC305 Spheres on Component Reliability in Harsh Thermal Cycling
Akkara, Francy John, Zhao, Cong, Sreenivasan, Arvind, Su, Sinan, Abueed, Mohammed, Hamasha, Sa'd, Ali, Haneen, Suhling, Jeff, Lall, PradeepYear:
2020
DOI:
10.1109/ITherm45881.2020.9190943
File:
PDF, 1.27 MB
2020