Research of Wafer Level Bonding Process Based on Cu–Sn...

Micromachines 2020 / 08 Vol. 11; Iss. 9

Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic

Wu, Daowei, Tian, Wenchao, Wang, Chuqiao, Huo, Ruixia, Wang, Yongkun
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Volume:
11
Journal:
Micromachines
DOI:
10.3390/mi11090789
Date:
August, 2020
File:
PDF, 10.33 MB
2020
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