[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fan-In Panel-Level with Multiple Diced Wafers Packaging
Lau, John H, Ko, Cheng-Ta, Tseng, Tzvy-Jang, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, DavidYear:
2020
DOI:
10.1109/ECTC32862.2020.00184
File:
PDF, 1.65 MB
2020