[IEEE 2020 IEEE 70th Electronic Components and Technology...

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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - The effect of solder paste volume on solder joint shape and self-alignment of passive components

Pan, Ke, Ha, Jong Hwan, Pham, Van Lai, Wang, Huayan, Xu, Jiefeng, Park, S.B.
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Year:
2020
DOI:
10.1109/ECTC32862.2020.00204
File:
PDF, 688 KB
2020
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