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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling
Kamrul Hasan, S. M., Fahim, Abdullah, Suhling, Jeffrey C., Hamasha, Sa'd, Lall, PradeepYear:
2020
DOI:
10.1109/itherm45881.2020.9190579
File:
PDF, 822 KB
2020