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Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation
Ahn, Woojin, Cornigli, Davide, Varghese, Dhanoop, Nguyen, Luu, Krishnan, Srikanth, Reggiani, Susanna, Alam, Muhammad AshrafulVolume:
10
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.3015658
Date:
September, 2020
File:
PDF, 1.09 MB
2020