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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development and Reliability study of 3D WLCSP for automotive CMOS image sensor using TSV technology
Ma, Shuying, Liu, Yi, Zheng, Fengxia, Li, Feng, Yu, Daquan, Xiao, Aimo, Yang, XiaobingYear:
2020
DOI:
10.1109/ECTC32862.2020.00080
File:
PDF, 924 KB
2020