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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effective Substrate Thermal Conductivity Modeling Method Extracted from Detailed Pattern for Premium SOC Packages
Hwang, Seungtae, Lee, Bang weon, Kim, Taehwan, Hyun, Younghoon, Hwang, Heejung, Ryu, Seunggeol, Choi, Mina, Kim, Youngdeuk, Oh, DanKyung SukYear:
2020
DOI:
10.1109/ITherm45881.2020.9190556
File:
PDF, 1.01 MB
2020