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[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - General Thermosyphon Simulation Code for Electronics Cooling Applications
Marcinichen, Jackson B., Amalfi, Raffaele L., Cataldo, Filippo, Thome, John R.Year:
2020
DOI:
10.1109/itherm45881.2020.9190310
File:
PDF, 1.43 MB
2020