Optical Beam-Based Defect Localization Methodologies for...

IEEE Transactions on Components Packaging and Manufacturing Technology 2020 / 9 Vol. 10; Iss. 9

Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects

Jacobs, Kristof J. P., Li, Yunlong, Stucchi, Michele, De Wolf, Ingrid, Van Huylenbroeck, Stefaan, De Vos, Joeri, Beyne, Eric
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Volume:
10
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.3014161
Date:
September, 2020
File:
PDF, 3.00 MB
2020
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