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Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array
Kuo, Chien-Hung, Hu, Allen H., Hung, Lance Hongwei, Yang, Kuei-Tzu, Wu, Chen-HuaVolume:
276
Journal:
Journal of Cleaner Production
DOI:
10.1016/j.jclepro.2020.124301
Date:
December, 2020
File:
PDF, 2.65 MB
2020