[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package
Chiu, Tz-Cheng, Wu, Ji-Yen, Liu, Wei-Te, Liu, Chang-Wei, Chen, Dao-Long, Shih, MengKai, Tarng, DavidYear:
2020
DOI:
10.1109/ECTC32862.2020.00193
File:
PDF, 560 KB
2020