[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level Packaging on FlexTrateâ¢
Alam, A., Molter, M., Gaonkar, B., Hanna, A., Irwin, R., Benedict, S., Ezhilarasu, G., Macyszyn, L., Joseph, M. S., Iyer, S. S.Year:
2020
DOI:
10.1109/ECTC32862.2020.00160
File:
PDF, 1.66 MB
2020