[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach
Wunderle, B., Meszmer, P., Mohnot, A., Tavakolibasti, M., Johrmann, N., Zschenderlein, U., Arnold, J., Voigt, S., Mehner, J., Ecke, R.Year:
2020
DOI:
10.1109/EuroSimE48426.2020.9152734
File:
PDF, 2.19 MB
2020
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