![](/img/cover-not-exists.png)
[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion
Kumahara, Kousei, Liang, Rui, Lee, Sungho, Miwa, Yuki, Murugesan, Mariappan, Kino, Hisashi, Fukushima, Takafumi, Tanaka, TetsuYear:
2020
DOI:
10.1109/ECTC32862.2020.00192
File:
PDF, 1.11 MB
2020