[IEEE 2020 IEEE 70th Electronic Components and Technology...

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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion

Kumahara, Kousei, Liang, Rui, Lee, Sungho, Miwa, Yuki, Murugesan, Mariappan, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu
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Year:
2020
DOI:
10.1109/ECTC32862.2020.00192
File:
PDF, 1.11 MB
2020
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