Molecular Dynamics Simulation of Heat Transfer at Contact...

IOP Conference Series Materials Science and Engineering 2019 / 10 Vol. 627

Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die

Lu, Baoshan, Wang, Leigang, Ma, Xiang
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Volume:
627
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/627/1/012024
Date:
October, 2019
File:
PDF, 1.20 MB
2019
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