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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Defect detection: Defect Classification and Localization for Additive Manufacturing using Deep Learning Method

Han, Feng, Liu, Sheng, Liu, Sheng, Zou, Jingling, Ai, Yuan, Xu, Chunlin
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Year:
2020
DOI:
10.1109/ICEPT50128.2020.9202566
File:
PDF, 2.73 MB
2020
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