Thermomechanical Study and Fracture Properties of Silicon...

IOP Conference Series Materials Science and Engineering 2019 / 05 Vol. 521

Thermomechanical Study and Fracture Properties of Silicon Wafer under Effect of Crystal Orientation

Romdhane, Mohamed Cherif Ben, Mrad, Hatem, Erchiqui, Fouad, Mrad, Ridha Ben
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Volume:
521
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/521/1/012004
Date:
May, 2019
File:
PDF, 777 KB
2019
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