[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates for Surface Acoustic Wave Sensors in High Temperature Applications

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