![](/img/cover-not-exists.png)
[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates for Surface Acoustic Wave Sensors in High Temperature Applications
Schwarzer, Christian, Hensel, Alexander, Roth, Frederik, Franke, Joerg, Kaloudis, MichaelYear:
2020
DOI:
10.1109/ECTC32862.2020.00250
File:
PDF, 877 KB
2020