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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Numerical study of edge condensation in wafer to wafer bonding process with lattice Boltzmann approach
Lee, Jung Shin, Hyung Kim, Jun, Woo Rhee, Daniel MinYear:
2020
DOI:
10.1109/ECTC32862.2020.00258
File:
PDF, 643 KB
2020