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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density
Wong, Ryan, Ravichandran, Siddharth, Lee, Haksun, Smet, VanessaYear:
2020
DOI:
10.1109/ECTC32862.2020.00326
File:
PDF, 991 KB
2020