![](/img/cover-not-exists.png)
[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Preparation and Low Temperature Sintering of Silver Nanoparticles Based Pastes for Power Semiconductor Device Interaction
Shen, Qinchen, Liang, Xianwen, Li, Gang, Zhu, Pengli, Zhao, Tao, Sun, Rong, Fan, YanfangYear:
2020
DOI:
10.1109/ICEPT50128.2020.9202630
File:
PDF, 2.69 MB
2020