Thermal Stress-Aware CMOS-SRAM Partitioning in Sequential...

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IEEE Transactions on Electron Devices 2020

Thermal Stress-Aware CMOS-SRAM Partitioning in Sequential 3-D Technology

Salahuddin, Shairfe Muhammad, Litta, Eugenio Dentoni, Gupta, Anshul, Ritzenthaler, Romain, Schaekers, Marc, Everaert, Jean-Luc, Yu, Hao, Vandooren, Anne, Ryckaert, Julien, Na, Myung-Hee, Spessot, Ales
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Year:
2020
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2020.3023923
File:
PDF, 1.82 MB
2020
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