[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Comparison between the Theoretical, Experimental and Numerical Thermal Conductivity of Composite Thermal Interface Materials using Copper Metal Foam
KAWAKITA, Shinya, TERANISHI, Minami, ISHIZAKA, Yuki, FUSHINOBU, KazuyoshiYear:
2020
DOI:
10.1109/itherm45881.2020.9190416
File:
PDF, 1.68 MB
2020