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[IEEE 2019 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo) - Odessa, Ukraine (2019.9.9-2019.9.13)] 2019 International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo) - Thermal Stress in Encapsulated Electronic Packages

Kovtun, Igor, Petrashchuk, Svitlana, Boiko, Juliy
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Year:
2019
DOI:
10.1109/ukrmico47782.2019.9165520
File:
PDF, 633 KB
2019
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